Wire Bond Process Technician
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Posted on Jan 26, 2023
Requirements
- Diploma in related discipline
- min 2 years relevant working experience
Job Responsibilities
- To follow up on line process issues and feedback to Engineer
- Assist Engineer in process optimization and evaluations
- Internal lot disposition
- Data collection and monitoring of Engineering lots
WLCSP Senior Engineer
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Posted on Jan 26, 2023
Requirements
- Degree in Engineering with min 5 years related experinece
- Min 5 years related experience in semiconductor industry
Job Responsibilities
- Responsible for Die Prep process and equipment as demonstrated by the yield, quality, reliability performance of all customer products.
- Drive, establish and implement KPI programs to improve robustness of process capability and prevent yield/quality excursion. Drive, initiate and implement continuous improvement projects on identified/reported or potential issues.
- Drive, establish and implement process simplification/optimization programs/ process &equipment automation projects to improve yield, quality, lead time & cost.
- Drive cost saving projects through improve & qualify new cost effective factory supplies and indirect material, factory supplies usage/wastage of reduction to meet Finance cost/sale target.
Yield Integration Engineer
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Posted on Jan 26, 2023
Requirements
- Minimum 3 years of experience in related field or equivalent field (Preferably in Semicon/ Substrate/ Electronics industry)
- Knowledge of quality tools such as SPC, MSA, FMEA, CP, etc.
Job Responsibilities
- Provide daily/weekly/monthly reports to the customer or internal if requested
- Alerting the related area and team in case of increasing yield loss, FM (Foreign Material) or PCS (Process Control System)
- Working closely with Process/Equipment Engineering Team /Manufacturing to identify and fix the causes of yield loss/PCS/FM issues
- Defining yield, PCS & FM targets based on customer and internal business needs
Die Attach Engineer
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Posted on Jan 26, 2023
Requirements
- Degree in Electronics / Electrical /Mechanical Engineering.
- Min 2 years in semiconductor industry in the field of assembly engineering.
- Experience in die attach process.
- Good knowledge of FMEA, DOE, SPEC and risk analysis.
Job Responsibilities
- Responsible for process ownership of Die Attach machine in assembly line.
- Establish and setup new die attach assembly process capabilities and materials including hand-on equipment setup.
- Monitor performance, quality and reliability of die attach process. Identify problems, recommendation, and implementation of corrective and preventive actions.
- Support engineering build requests, rump ups and platform extensions.
Tester Engineer
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Posted on Jan 26, 2023
Requirements
- Bachelor Degree in Engineering witn min 1-2 yrs of related experience.
Job Responsibilities
- Responsible for tester preventive maintenance, calibration, modification, and improvement.
- Responsible for equipment MTBF, BDO, & downtime performance.
- Support production OEE performance.
- Spare board control and usage monitoring.