Overview
Plastic ball grid array (PBGA) are BGA packages adopting plastic (epoxy molding compound) as the encapsulation. According to JEDEC standard, PBGA has an overall thickness of over 1.7mm.
Application
ASE PBGA's design and features improve the performance of graphics, PLDs, DSPs, PC chipsets, communications, networking, microprocessors/controllers, ASIC, gate arrays and memory packages.
Features
BGA is suitable for high power and high speed ICs requiring superb electrical and thermal enhancement.
15x15 mm to 45x45 mm package
119 balls to 1520 ball count
High interconnect density
Low assembly cost
Self-alignment during reflow
Low profile
Ease of thermal and electrical management
Ease of routing
Good power dissipation
JEDEC MS-034 standard outlines
Lead free process available
Full In-house designcapability
Overview
Heat slug BGA (HSBGA) is an upgraded type of PBGA. Within the molding area, a piece of copper heat slug is implanted. The heat slug is intended to lower the thermal resistance(BJA) of PBGA without change of material. The BJA of HSBGA is generally 20% lower than PBGA and achieves 5 to 6W of thermal dissipation under natural convection. This technology can be applied to any kind of die-up substrates (e.g. 2- or 4-layer BT,and metal core). HSBGA is an excellent solution for cost-effective high power package, high speed ICs like graphics chips, communication and networking ICs.
Application
HSBGA is excellent for products that require improved thermal performance such as high power packages for high speed ICs in personal computers, networking and graphic ICs, data communication, consumer ICs and in telecommunication applications.
Features
HSBGA is suitable for high power and high speed ICs requiring superb electrical and thermal enhancement.
15x15 mm to 45x45 mm package available
120 balls to 1520 ball count available
Cost effective
Good electrical performance
Good thermal performance
Good power dissipation
JEDEC MS-034 standard outlines
Lead free process ready and available
Full In-house design capability
Full electrical and thermal characterization capability
Overview
This thin package solution has become available due to significant improvement in substrate and die thinning technology.
* Small, thin and light package
* Flexible design
* Low cost and & time to market high volume production
* Competitive reliability performance (MSL3@260°C)
Application
LBGA is commonly used in hand-held devices, like computer, communication, and consumer devices. Increasing demand for thin packages with high density performance make LBGA a highly competitive and reliable package solution to meet this growing demand. This package is highly recommended for Memory (SRAM, PSRAM, Flash, DRAM), Graph, ASIC, Digital and Analog products.
Features
3x3 mm to 21x21 mm body size available
Max 672 I/Os
0.4/0.5/0.65/0.75/0.8/1.0 mm in ball pitch
Rigid and customized routing substrate design
High density interconnection
Full in-house design capability
Fine pitch wire bond capability
Low assembly cost
Self-alignment during re-flow
High speed performance
Lower profile (Package thickness)
RoHS/ Pb Free & Green Package process ready and available
Ease of thermal and electrical management
Ease of routing
JEDEC standard criteria
Overview
Cost savings BGA (CSBGA) is one of two types of cavity-down thermally enhanced BGA offered at ASE. It is designed with the chip seated onto the copper heat sink to absorb the heat easily. This method desensitizes the performance deviation out of the chip size and lowers the thermal resistance of junction-to-case (θJC) which makes the external heat sink or fan work more effectively.
Cavity-Down BGA enhance thermal performance by about 15~20% improvement compared with 4-layer PBGA and by 35% compare with 2-layer PBGA. Electrical performance of Cavity-Down BGA is significant as well. Reasons are attributed to their flexible layout for staggered traces on different layers, shorter VIAS and better shielding effect out of the copper heat sink. With the heat sink covering the signal traces fully, Cavity-Down BGA provides better resistance to external EMI (Electro- Magnetic Interference) noise.
Application
Thermally enhanced package design extensive applications include high-speed, high-power semiconductors, such as ASICs, Micro processors, Gate Arrays and DSPs. CSBGA market covers telecom/cellular, laptops/sub-notebooks, PDAs, VME CPU/BUS boards, video GUI and wireless.
Cavity-Down BGA is an excellent solution for graphic, networking & communication ICs with high-power and high-speed quality performances.
Features
Superior thermal performance (>6W)
Superior electrical performance
Relative low cost with 10 ~ 50% cheaper compare with L2BGA
Laminated substrate design with path through hole VIA for low cost saving solution
Designed substrate with side wall plating on cavity edge to reduce wire length and increase design density
JEDEC MO-192 / MS-034 standard outlines