Overview
Based on copper lead frame, Quad Flat No-lead (QFN) or microchip carrier uses half-encapsulation technology to expose the rear side of the die pad and the tiny fingers, which are used to connect the chip and bonding wire with the PCB. QFN packages are suitable for applications over 12GHz working frequency. Providing both thermal and electrical enhancement, QFN is a cost-effective packaging solution due to its economical materials and simpler packaging process.
Application
Telecommunication products
Cellular phones
Wireless LAN
Portable products
Personal digital assistants
Digital cameras
Low to medium lead count packages
Information appliances
Features
Small footprint
Low profile (< 0.9 0.2 L/F + 0.65 Mold)
Light weight
Cost effective
Better electrical performance
Better power dissipation
Overview
Land grid array (LGA) uses laminate substrate to form the landing pad and the exposed pad for performance enhancement. It is essentially a BGA minus the solder balls. LGA’s advantage over other leadless packages are its flexible routing and multi-chip module capability. LGA is also a thinner (down to 0.5 mm) and lighter CSP. LGA technology has been developed for lead free solution and spacing reduction on mother boards. This type of package has chip size solution based on mature laminated substrate technology and material.
Application
LGA is suitable for high performance ICs like Single Chip, CPU, Logic and Memory. Common applications for this type of package includes:
Telecommunication products
Cellular phone-RF Devices
Wireless LAN
Portable products
Personal digital assistants
Digital camera
IC recorders
MP3 players
Memory card
Memory card
SD card
MS card
PCMCIA
Compact
Features
Thinner, lighter and smaller Chip-Scale Package
Mature standard matrix BGA assembly process
‧Higher yield/quality
‧Higher though-put
‧Lower cost
Space reduction in system level
Pb free solution
Excellent electrical and thermal performance
Overview
To service the fast growing market within PDA and cell phone, this smaller chip size is essential. In 2001, ASE licensed Ultra CSP® from Kulicke & Soffa’s Flip Chip Division. ASE also provided several enhanced structures called “aCSP™” by polyimide, PBO, or thicker Cu RDL to meet various customer demands.
Application
Applications of aCSP™ include bluetooth, Wi-Fi, GPS, FM radio, analog devices, microcontrollers, integrated passives, EEPROM, power and voltage regulator, power amplifier and RF devices. End application include cell phones, PDAs and system boards.
Features
Real chip size (smallest, thinnest and lightest)
High density interconnection
High-speed data processing
Batch process- assembly processed in wafer form
Wire-bond type die can be directly switched to aCSP