ICpackaging (a.k.a. IC assembly) is one of the essential processes and technologies in IC manufacture, connecting the bare die to the PCB. It serves as a reliable and easily testable vehicle for susceptible chips. The requirements for the new generation of electronic devices are features of our advanced IC packaging: low profile, high power dissipation, and better performance in terms of voltage and reliability.

This section is a repository of information about ASEM’s package offerings and capabilities. It provides an overview of each package type in our product families, which includes the features, applications, design rules, relevant reliability, performance data, etc.

New Package(Under Development)

- Flip Chip



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