Overview
Plastic Leaded Chip Carrier (PLCC) is widely used in micro-controllers and consumer electronics. Each lead of the PLCC is formed into a "J"-shape and folded under the package body. ASE provides PLCC packaging services in compliance with JEDEC standard. Lead count ranges from 20 to 84 with 1.27mm (50mil) lead pitch.
Application
ASE's PLCC product was designed in compliance with JEDEC standard for 'J' shape leaded SMT packages. Its robust leads and smaller foot space makes it applicable for surface mount and replaceable plug-in assembly via sockets. Design applications include memory, processors and controllers, ASIC, DSP, PC chipset device for consumer product, automotive and aerospace.
Features
453~1153mils body sizes
28~84 available lead counts
JEDEC standard compliant
Wide selection of pad size to die size
High conductivity lead frame
Wide selection of pad size to meet die size per customized lead frame design capability
Pb-free process ready and available
Overview
Quad flat package (QFP) is popular among the quad packages. The reason is the fine etching or stamping lead frames enables QFP to contain more leads and feature a smaller profile to perform better electrical characteristics by shortening the interconnection (the lead width can be as small as 0.16mm while the outer lead pitch is 0.4mm only). The thinner and flexible leads in gull-wing shape also provide better 2nd-level reliability (package-to-PCB reliability).
The package with drop-in HS can allow more than 50% power dissipation compared with a conventional package (e.g. in QFP 28X28mm, the allowable power of standard type and the type with HS is about 2.1W and 3.5W respectively). This drop-in HS drives off the heat from the chip more easily by extending the conduction area, and transferring more heat via the lead frame. QFP with drop-in HS is to package sizes of 14X20, 28X28, and 32X32mm.
Application
Products
‧Portable consumer products (PDA, Digital camera...)
‧System board
‧Power controller
Quad packages have been used for years to meet increasing challenges of faster processors / controllers, ASICs, DSPs, gate arrays, logic, memory ICs (EEPROM, Flash, DRAM & SRAM), PC chipset, video-DAC, multi-media and other related application.
HS-QFP is suitable for use in high thermal applications like Power & Voltage Regulators, Power Amplifi ers, etc
Features
High-speed data processing
High density interconnection
Cost Competitive
MCM /Stack structure design
High thermal conductive
Fine Pitch wireobond capability
Pb-free process ready and available
JEDEC standard compliant
Overview
Low profile and thin quad flat packages (QFP) are classified by the overall thickness (t)
according to JEDEC definition:
‧L type: 1.2< t <=1.7 mm
‧T type: 1< t <=1.2 mm
Low profile and thin QFPs are becoming popular, as they are ideal for the applications in lightweight and portable electronic products. ASE offers the lead count of LQFP/TQFP ranging from 32 to 256 and 44 to 176 respectively, covering almost all the applications in memory, DSP, and communication ICs. Due to the low electrical parasitic out of the small outline and shorter leads, low and thin QFPs are suitable for RFICs, and a cost-effective alternative to expensive ceramic QFPs.
Application
Telecommunication products
Cellular phones
Wireless LAN
Portable products
Personal computer
Personal digital assistants
Digital camera
Medium lead count packages
Information appliances
LQFPs are ideal package for lightweight and portable electronic products requiring broad performance characteristics. The low electrical parasitic out of the small outline and shorter leads makes LQFP suitable for RFICs. Other LQFP applications include lap-top PCs, memory, video ASIC, DSP, controllers, processors, gate arrays (FPGA/PLD), SRAMs and PC chip sets, telecom, office equipment, disc drives and communication boards.
Features
LQFP
7 x 7 mm to 28 x 28 mm body size available
Wide selection of pad size to meet die requirements
Customize leadframe design capability
32 ~ 256 leads counts available
Fine Pitch wirebond capability
Lead free process ready and available
High conductivity Copper leadframes
Low stress die attach materials
Power enhancement version
JEDEC standard compliant
TQFP
10 x 10 mm to 20 x 20 mm body size available
Wide selection of pad size to meet die requirements
Customize leadframe design capability
44 ~ 176 leads counts available
Fine Pitch wirebond capability
Lead free process ready and available
High conductivity Copper leadframes
Low stress die attach materials
Power enhancement version
JEDEC standard compliant