Reliability Test Capability

To remove moisture from package

Model : WTC Binder

Condition

Temp: 125°C for 24hrs

Ref: J-STD-020

Max.Temp: 300°C

To evaluate the moisture resistance (preconditioning) of package as per MSL or customer requirement

Model : WEISS TECHNIK SB22 ,HERAUS HC0020 & ENVIROTRONICS FLX-500

Condition

As per JEDEC MSL requirement

Temp: 160°C to - 40°C

Humidity range: 10% to 98% RH

Ref: J-STD-020

Model: BTU Paragon 70 5 Zones

Condition

Convection Type

Max Peak Ta = 350°C max

Max 3X Reflow

Leadfree Package @ 250°C-260°C

Non-Leadfree Package @220°C- 240°C

Ref: JEDEC A112/113 & J-STD-020

To evaluate the thermal and mechanical stressed imposed on a device during SMT/Reflow process

Model: Weiss TS130 (Basket type) & ACS CST130 (Shutter type)

Condition

Convection Type

2cyc/hr (12~15mins each Zone)

approx. 50cyc per day ( 500cyc – 10days & 1000cyc – 20days )

Temp range: 180°C to -85°C

Ramp rate: 10°C to 15°C/minute

Ref: JESD 22- A104 and MIL STD 883

To evaluate package and die interface mechanical resistance to alternate exposures of high and low temperature changes

To evaluate the stress test integrity of mold compound and leadframe interface

Model: Hirayama PC-422R7

Condition

121°C/ 100% / 29.7 psia/ 168hrs

Test Temp range: 105°C to 150°C

Test Humidity range: 65% to 100%RH

Test Pressure range: 14.5psi to 43.5psi

Chamber capable to be converted to both PCT and HAST condition

Ref: JESD22-A102

To evaluate the stress test integrity of mold compound and leadframe interface(Accerelated)

Model: Hirayama PC-422R8

Condition

130°C/ 85% / 33.3 psia/ 168hrs

Test Temp range: 105°C to 150°C

Test Humidity range: 65% to 100%RH

Test Pressure range: 14.5psi to 43.5psi

Chamber capable to be converted to both PCT and HAST condition

Ref: JESD22-A118

To simulate the thermal and mechanical stress imposed on device when mounted on PCB

Model : Despatch LAC Series Oven

Condition

150°C for 1000hrs

Max.Temp: 300°C

Ref: JESD 22 - A103

To non- destructive study on the package delamination using acoustic signal

Model : ECHO STANDARD AND FUSION (SONIX )

Condition

Type of scan: A-scan, B-scan, C-scan, Thru Scan, Tami Scan

Transducers used: 15MHz, 25MHz, 35MHz, 75MHz ,110MHz & UHF 5.9mm

Delamination acceptance criteria as per

Ref: J-STD-020 & J-STD-035