Overview

ASEM’s Design and Development center offer package, substrate and leadframe design for customer. Our major task is to design high electrical/thermal /reliability performance and low cost leadframe/substrate design for our valuable customer.

ASEM always assist the customer in optimizing the semiconductor packages design to meet the customer’s power, ground, impedance control, I/O requirement and stress level by conducting the electrical and mechanical simulation. Our vision is to reduce the overall design cycle time, time to market and packages cost to meet the demand of today semiconductor industry. The Design and Development center is well equipped with latest and sophisticated software for this vision.

Design Flow

High Speed Design Capability [Up to 30GHz]

Typical basic requirements for High Speed Substrate Design :
- Impedance
- Signal integrity

Design/Layout tools

- AutoCad
- Cadence Advance Package Designer

Design Information

- Microsoft office format netlist (pad coordinates, net name, ball no.)
- Die information (CAD file or Microsoft office format)

Design output file format/Drawing offering

Bonding diagram

-Autocad (*.dwg)
-Acrobat (*.pdf)

Layout Drawing

-Autocad (*.dwg)
-Gerber RS 274X (*.art)
-Acrobat (*.pdf)