About
Final Test is a process where IC units which are assembled, encapsulated and singulated will be tested on its electrical functionality.
Final Test process done with the presence of the equipment called Handler and Tester. A lot with units will be loaded into a Handler with respective settings and the handler will pick and place the units and placed on the test site for testing. The test site in the handler is connected to a Tester. The electrical functionality of the units will be tested via lead / lead pad the units. The signal from test site will be sent to tester to determine if a unit pass or fail electrically. Upon completion the process, a Test summary will be provided by the tester which print out the results of the testing performed.
Final Test is a very crucial as wafer sort process because it sort out the good tested units and reject unit into different bins. This process will determine the electrically good units to be shipped out and indicate the presence Assembly Process Issues via the Test Results.
Test Capabilities
Test Handler Capabilities
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Models
XD208
- Type: Bowl Input
- Applicable Packages: QFN/MLP(size: from 1.0x0.6 to 12x12), SOIC, SOT23, SC70, SOT89, SOT223
- UPH: 36k
- Input: Bowl Feed
- Output: Tape and Reel
- No. of Test Site: 4
- Optional Vision System:
- Mark & Orientation or PVI
- 3D Lead or Bottom Pad or 5S
- 2D In-Pocket Mark/Orientation
Hontech HT7048
- Applicable Device: QFP, TQFP, CSP, PLCC, QFN, BGA, LGA, PGA, TSOP, MMC, SD...
- Device Dimension: Device Body Outside(3x3 - 40x40)
- Test Sites:
- 1x2 : X=80mm
- 1x4 : X=40mm
- 2x2 : X=80mm, Y=60mm
- 2x4 : X=80mm, Y=60mm
- Max. Throughput: 4000 pcs/hour
- Jam Rate: < 1/5000 pcs
- Mechanical Index Time: < 0.4 sec(Index time varies depend on the kind of device and socket
- Applicable Tray: JEDEC Type(W-110~140, L-220~330, T<12mm)
- Tray Loader/Unloader Capasity:
- Input Tray: Elevator with 200mm stroke(Max. Weight 15kgs)
- Output bin Tray 1,2,3: Elevator with 200mm stroke(Max. Weight 15kgs)
- Output manual bin Tray 4,5,6: One Tray
- Empty Tray: buffer Max. 4 Trays, Output: buffer Max. 4 Trays
- Max. dimension on test head: 1100mm(W) x 1100mm(D) x 1076mm(H)
Matrix
- High Performance, Configurable Pick-and-Place Handler
- High Productivity
- 16000 uph
- Up to x32 test site parallelism
- Auto contact cleaning
- Auto retest, auto retry
- Continuous load/unload, lot cascading
- Universal recipe
Delta Castle LX
- Scalable Platform
- Parallelism: x1 up to x9
- Up to 8 Output tray locations
- Device Rotator Option
- Handles QFP, µBGA, BGA, QFN, CSP, SOIC, PLCC, etc.
- High Productivity
- Up to 5200 uph
- Tri-Temperature Handler
- 85 msec/device index time (x8 configuration)
- Handling of 4x4mm and larger Packages
- Tool-less Kit Changeover (<30 min typical)
- Auto Contactor Cleaning
- Automatic Retest at End-of-Lot
Rasco SO1000
- High Productivity
- Up to 8 Tubes Soak Capacity
- Best in class total cost of ownership
- Highest reliability
- Flexibility
- QFN 3mm -> 12mm
- MSOP -> SO450
- Single, dual, quad configuration
- Large variety of contactors
- Full tri-Temp range -60˚C to +175˚C
Seiko Epson
- Device Type:
- QFP, TSOP, CSP, WLCP, BGA, QFN, PLCC, LGA, PGA
- Min. 3x3 to Max. 50x50 (Lead pitch: 0.4mm or more)
- Test Mode:
- 16-site (8x2)
- 8-site (4x2)
- Square 4-site (2x2)
- In-Line 4-site (4x1)
- 2-site
- Busy Shuttle (Single)
- Testing Area:
- 264mm x 130mm
- 184mm x 130mm
- Standard socket pitch (mm):
- Heating method: Heating Plate
- Index time:
- 0.42 sec (up to 1600 N)
- 0.4 sec (up to 1200 N)
- 0.58 sec (up to 2400 N)
- Throughput: 13500 units
- Tray classification: Max.6 classification (3 auto loaders, 3 manual loaders)
- Tray size: JEDEC (135.9 x 315.0)mm
- Temperature accuracy:
- +50˚C to +90˚C ± 2˚C
- +90˚C to +155˚C ± 3˚C
RoadMaps
Handler
Flex Family
J750 & IP750
V93K Platform
Chroma 36XX Series
Amoeba7600 Series
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